IEEE Build-Up Substrate Symposium (BUSS)

Substrate Technologies: New Innovations, Challenges, Financing

BUSS’24 is a two-day, in-person event — May 2-3, 2024 at SEMI Hdqtrs, Silicon Valley, CA USA

Download our BUSS Symposium Advance Program Review the Extended Advance Program Registration is now open!

We are living in the era of heterogenous integration driven by fast, efficient and big data computing resources at our fingertips. The mega-monolithic silicon chip is a thing of the past, replaced with 3D heterogenous integration of chiplets onto a platform made of an organic build-up substrate. Volume manufacturers of build-up substrates are entirely based in Asia, leaving a desert in the US. Volume build-up substrates used by major IDMs are manufactured in Asian countries including Taiwan, Japan and China.
However, there are multiple activities starting up in the US, and this is why a gathering of the US players is important. This symposium is geared for all those involved in the supply chain of build-up substrates in the US, as well as users. As the US Congress debates H.R. 3249, the Protecting Circuit Boards and Substrates (PCBS) Act, this Symposium is an opportunity for all build-up substrate players to meet, network and cohesively work with funding agencies who will be invited to this symposium to focus on onshoring build-up substrate production and utilization.

Sessions:

— Substrate Manufacturing and Onshoring
— Materials for Substrates
— Emerging Substrate Technologies
— Panel Equipment and Technologies for Substrates
— Inspection and Testing

… plus two panels:
— Substrate End Users
— Onshoring and Startups

PLAN TO ATTEND!

Confirmed Speakers at BUSS:

Wafer Level Substrates – An Emerging New Technology Steven Verhaverbeke, Applied Materials		Advanced X64 UCIe Interface Implementation on a Substrate Farhang Yazdani, Broadpak
Chiplet Integration on Organic Buildup with Silicon Interconnect Fabric Vineeth Harish, UCLA, and Prof. Ken Yang, UCLA		The Future of AI and HPC Substrates: A Breakthrough Interconnect Technology Rozalia Beica, LQDX
Substrate Materials for Advanced Packaging Masato Fukui, Resonac America		NAPMP Plans and Advanced Substrate Onshoring Dan Berger, NIST, and Subramanian Iyer, UCLA
Advanced Packaging Metallization: Substrate Interaction with Catalyst and Electroless Deposition of Copper Purnima Narayanan, Yield Engineering Systems		QCW CO₂ Laser Drilling for FCBGA Applications Kyle Baker, MKS Instruments
Systems Solutions for Advanced IC Substrate Manufacturing Frank Bruening, MSD-Atotech		Enhancing Water Quality and Environmental Sustainability in ICS Manufacturing with Zero Liquid Discharge (ZLD) Gustavo Ramos, GreenSource Engineering
The Latest Vacuum Lamination Challenges and Technology Development Takuma Yoshikawa, Nikko Materials		Advanced Insulating Material for Next-Generation Packaging Yoshio Nishimura, R&D Group manager, Ajinomoto Co., Inc.
2.xD Integrated Substrate Solutions for High-Performance Computing Dr. Dyi-Chung Hu, SiPlus Co.		Advanced Metrology for High-Density Substrates Dr. Robert Bishop, Beltronics Inc.
USA Landscape for Substrate Manufacturing Venky Sundaram, 3D System Scaling		Advanced Insulating Material for Next-Generation Packaging Yoshio Nishimura, R&D Group manager, Ajinomoto Co., Inc.
Packaging Substrate Solutions for Advanced Packaging Requirements Dr. Sung Jin Kim, Absolics		Taiyo’s Photo-Dielectric for High Density Substrate Applications Yuta Ogawa, Taiyo Ink
Download the Advance Program

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with Orange County Chapter

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